Multi core at 64 cores to 120 cores.:
Silicon wafer made in Oregon USA.
Intel Fab E30 node.
Using a Software to make Efficiency core hallways and Performance tile multiroom with L3, L2, L1 cache
The Apartment has the extra Samson BGA pillars for making precision attachment to the Bonding wafer
The Abacus Xeon 10, bonds 9 Xeons together like a Post it note.
has the Ram stack technology.
Causing the Xeon to use demo 36 e cores, with L L run around Samson BGA tile, with, Bonding 3D wafer.
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Oregon Xeon 3nm 1U robotic. BGA1824.
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