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56 Cores
150watts
Intel
Xeon Sample.

being imprinted lithography
at 1kilowatts.

! doing !
Office servers.

The plasma Correction has to be narrow 193nm or 14nm (consistency improvement than HeBi/LiSn).

+ Nanoimprint lithography: Reticule Diffuser: Lens, and the block stamp --> Wafer with Coating.

_ Creating Imprints onto Wafer and Using Sputtering Ceramics to make CisFet ribbons

_ 3D bonding with SDram, onto, Underbridges tabulations within limits of under 1.4Nanometers

Xeon with Variants Samples.

196 efficiency cores tiles.

Dense Plasma Quartz tube at random harmony --> correction lens, mirrors with additive lazer ICBO into 193nm or 14nm --> then Using NIL to stamp 1 dot 4 Nanometers ranging to 10nanometers.

- This makes Multi tiles, chiplets, and SRAM underbridges: with the Interposer silicon

- This makes 1.4 nanometers range 10 nanometers range.

- Causing the ARM or RiscV M zero for fridges, washingmachines, etc appliances to be faster made, in reasonable 1kilowatt per Masksheet.

- The ESP RiscV with Ram 32Gb + Solar panel 50watt + 3.8Ah battery + ethernet static iP, and various Software coding makes internet webpages and internet toolsets:

"quote:"

NASDAQ, TSX, NYSE: discounts the stock by splitting into 1/30th and continues to imprint 1 dot 7 Nanometer server processors at discounting pricing:

- pyrheliophor crucible melts sand oxide into silicon 999 purity

- Czochalski method -- Makes silicon 999,999 purity

- Using this lithography plasma correction ICBO mirrors and wavelength 193nm/13.5nm

- wafers consistent.

- To make 1 dot 7 Nanometer CIsfet, and can be xeon, epyc, arm, riscv, and etc etc.

: The gold bonding nanowires (to be) Artificial microscopic bonded from underbridges to:
SRam, Ramstacks, 3D faveros, and multi tiles interconnect in reason.

With the Circular and waves, ceramics CISfet, and the additional of Optical fibers.

Xeons turned into Phyeons.

- Depending on the general architecture of CISfet
- Optical fibers allowance density scale.
- The strength signal of light optics fibers.
- The Send and recieve signal side of Phyeons.
- Noise or interference cancel mechanisms.

! The Xeons turns into General Photonic Interface Circuits with Phyeons.
- Steering the channel, pitch and noise.
- Assert the light signals and calculative strength and dimming of photons.
- The Intel/ GPIC LLP.
Turns into a Processor lithographic die I/O that is operatable at 300Ghz to 1100ghz cycles.

This prediction notes, will challenge the TSX, NASDAQ, NYSE to be faster engines of technology - finance.

With the Circular and waves, ceramics CISfet, and the additional of Optical fibers.

Xeons turned into Phyeons.

- Depending on the general architecture of CISfet
- Optical fibers allowance density scale.
- The strength signal of light optics fibers.
- The Send and recieve signal side of Phyeons.
- Noise or interference cancel mechanisms.

! The Xeons turns into General Photonic Interface Circuits with Phyeons.
- Steering the channel, pitch and noise.
- Assert the light signals and calculative strength and dimming of photons.
- The Intel/ GPIC LLP.
Turns into a Processor lithographic die I/O that is operatable at 300Ghz to 1100ghz cycles.

This prediction notes, will challenge the TSX, NASDAQ, NYSE to be faster engines of technology - finance.